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Shenzhen Fuchao Technology

Product Details
  • image of Microcontrollers, Microprocessor, FPGA Modules>100-1471-2
  • image of Microcontrollers, Microprocessor, FPGA Modules>100-1471-2
Model 100-1471-2
Product Category Microcontrollers, Microprocessor, FPGA Modules
Manufacturer Becom Electronics
Description IC MODULE CM-I.
Encapsulation -
Package Bulk
RoHS Status 1
image of Microcontrollers, Microprocessor, FPGA Modules>3175397
3175397
Model
3175397
Product Category
Microcontrollers, Microprocessor, FPGA Modules
Manufacturer
Becom Electronics
Description
IC MODULE CM-I.
Encapsulation
-
Package
Bulk
lang_roHSStatusStatus
1
Product parameters
PDF(1)
PDF(2)
PDF(3)
TYPEDESCRIPTION
MfrBecom Electronics
Seriesi.MX
PackageBulk
Product StatusOBSOLETE
Connector TypeExpansion 3 x 100
Size / Dimension3.150" L x 1.770" W (80.00mm x 45.00mm)
Speed1GHz
RAM Size1GB
Operating Temperature0°C ~ 70°C
Module/Board TypeMPU Core
Core ProcessorCM-i.MX53
Flash Size2GB (NAND), 4MB (NOR)
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